Omar Bchir

Omar Bchir is currently Vice President of Engineering on the Process and Package Solutions Team at Qualcomm.  He has worked in the field of IC packaging for >20 years, first joining Intel Corporation in 2004 as a Substrate Pathfinding Engineer. In 2008, he moved to Qualcomm, where he remained for eight years, forming a substrate team and eventually leading the Advanced Packaging team. In 2016, Omar joined Rockley Photonics, focusing on design and proof of concept for next-generation Opto-ASIC network switches for mega data centers. In 2017, he joined Micron Technology,  focusing on memory packaging development and optimization for automotive customers.  In 2020, Omar joined Amazon's Project Kuiper, developing packages for terrestrial and space-based applications to support low-latency, high bandwidth satellite-based broadband internet access.  Omar re-joined Qualcomm in 2023, and currently leads the Substrate Engineering, Automotive  and Mobile Packaging teams.   

Omar received a BS degree in chemical engineering from the Georgia Institute of Technology, and a Ph.D. degree in chemical engineering from the University of Florida. He holds 42 issued U.S. patents and has authored 13 publications.