Mohammad Kolbehdari

Dr. Moh Kolbehdari is Sr. Dir. of Advanced SoC/IC Packaging Architecture and Technology, with more than two decades of experinces spanning Intel, Segate/Xyratex, Qualcomm, Amkor Technology and Socionext USA. His work hs focused on system-in-pacakge co-architecture, including power dleivery (IVR/PDN), SI/PI integration, the therrmo,-mechnical reliabiity for high performance processors, AI accelerators, and Automotive SOCs, contributing to multiple high-volume  products and earning numerous awards and plaques.  He has served as Chair of Packaging Technology for Intel's internal DTTC conference and has participated in multiple internal and external comittees focused on advanced packaging, chiplet integration, and mnufacurability,  Dr. Kolbehdari holds B.Sc, M.Sc, and PhD. degrees in Electrical Engineering, with his doctrol research completed at Temple University (U.S.). His curent work centers on governed, physics-driven packaging methodologies - such as the Tri-loop (predict-> choose -> release)  and G0-G5 gatig framework -- to make advanced SoC/IC packaging auditable, efficeint, and scalable across next-generation AI and HPC platforms.