Ali Khoshniat
Ali Khoshniat received the B.S. degree from K. N. Toosi University of Technology, Iran, in 2006, the M.S. degree from Utah State University in 2011, and the Ph.D. degree from Santa Clara University in 2020, all in electrical engineering.
He has been working in the areas of RF/microwave, antenna, EMC, and signal integrity engineering. His prior experience includes signal integrity and hardware engineering roles at Micron Technology, Cisco Systems, DSSD (acquired by Dell EMC), and Cerebras Systems. He is currently Director of Packaging, Signal, and Power Integrity at Eliyan, focusing on high-speed digital design including 224G/448G SerDes, UCIe and BoW Die-to-Die interconnects for next-generation chiplet architectures.
Dr. Khoshniat was a recipient of the DesignCon 2020 Best Paper Award, the 2019 IEEE EMC Student Hardware Design Contest Award, and the 2011 IEEE AP-S Honorable Mention Award for Best Student Paper Competition.
Sessions
- IBIS-AMI Modelling Methodology for Simultaneous Bi-Directional (SBD) Die-to-Die Chiplet Connectivity
- Wednesday, February 25 • 9:00 AM - 9:45 AM Pacific Time (US & Canada)
- Panel – Advanced Packaging Technology
- Thursday, February 26 • 4:00 PM - 5:15 PM Pacific Time (US & Canada)