Alex Manukovsky
Alex Manukovsky is a Signal and Power Integrity Principal Engineer at Intel’s Network and Edge Group (NEX), responsible for Signal and Power Integrity of NIC products. Alex focuses on MCP and SCP design for IPU (sNIC) and fNIC markets. He is leading the SI/PI activities, defining PCB and Package design guidelines for internal and external customers. His areas of expertise include simulation, modelling, and analysis of high-speed serial links for PCIe, Ethernet and DDR interfaces. His past work focused on channel and SerDes I/O modelling, robust de-embedding and calibration techniques. His experience includes developing test equipment as well as lab measurement methodologies for compliance testing of serial I/O's. Alex joined Intel in 2010 after receiving his BSc in Electrical Engineering from the Technion – Israel Institute of Technology. In 2019 he received his Master's degree in System Engineering from the Technion – Israel Institute of Technology.
Sessions
- Boot Camp: AI Agents for SI/PI
- Tuesday, February 24 • 9:00 AM - 4:30 PM Pacific Time (US & Canada)
- Tutorial – How to Design Predictable Interconnects Up to 448 Gbps
- Tuesday, February 24 • 2:00 PM - 4:30 PM Pacific Time (US & Canada)
- Panel – Agentic AI for Electronic Design
- Tuesday, February 24 • 4:45 PM - 6:00 PM Pacific Time (US & Canada)
- Multi-Agent AI Systems for Autonomous Signal Integrity Analysis of PCB & Package Designs
- Wednesday, February 25 • 11:15 AM - 12:00 PM Pacific Time (US & Canada)