Benjamin Dannan

Benjamin Dannan is the Founder and Chief Technologist at Signal Edge Solutions. Benjamin Dannan is an experienced signal and power integrity (SI/PI) design consultant developing advanced packaging solutions for high-performance ASICs, chiplets, and complex FPGA designs. He has expert-level proficiency with multiple test and measurement solutions, including oscilloscopes, vector network analyzers (VNA), Time Domain Reflectometers (TDRs), function generators, and EMC lab testing equipment.

He is a senior member of IEEE with a multi-faceted background that includes a wide range of professional engineering and military experiences. His engineering experience includes designing, developing, and launching production products, including ASICs, radars, fully autonomous robotic platforms, pan-tilt-zoom (PTZ) camera video systems, and ground combat vehicles. 

He is a specialist in signal and power integrity concepts, high-speed circuits, and multi-layered PCB design, as well as has multiple years of experience with EMC product development and certifications to support global product launches. Additionally, he has extensive experience with Chip-Package-PCB-VRM power delivery network (PDN) principles.

Benjamin holds a certification in cybersecurity, has a BSEE from Purdue University, a Master of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq, totaling 47 combat missions, and a trained USAF Cyber Operations Officer. In addition, he was awarded the DesignCon 2025 Engineer of the Year, has co-authored multiple peer-reviewed journal publications, and has twice received the prestigious DesignCon Best Paper award, given to authors who are leading practitioners in semiconductor and electronic design.