Panel – Advanced Packaging Technology
Type
Panel Discussion
Speakers
Moderator
Director of Packaging Technology at Socionext USA
Panelist
Director of Packaging and SIPI at Eliyan Corp
Founder and Chief Technologist at Signal Edge Solutions
Fellow at AMD
VP, Engineering, Process & Package Solutions at Qualcomm
Fellow at Intel
Categories
Primary Track
- 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Education Level
- Advanced
Discipline
- Data Centers
Badge Access
- All-Access
- Expo Pass
- Premium Education
- Standard Education