Panel – Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements
Type
Panel Discussion
Handouts
Speakers
Speaker
CTO Office, Dir of optical technologies at Ranovus
Panelist
OIF Board Member at Broadcom, Inc.
OIF Physical & Link Layer Working Group Chair at Amphenol
Principal Engineer at Qualcomm
Categories
Primary Track
- 03. Integrating Photonics & Wireless in Electrical Design
Secondary Track
- 02. Chip I/O & Power Modeling: Strategies for Enhancing System Performance
Education Level
- Introductory
Discipline
- Artificial Intelligence
- Data Centers
- High-Speed Communications
Badge Access
- All-Access
- Expo Pass
- Premium Education
- Standard Education