Distributed Capacitor Characterization for Advanced Packaging
Type
Technical Paper Session
Handouts
Speakers
Speaker
Hardware Development Engineer at Amazon
Sr. Hardware Development Engineer at Amazon
Author
SI/PI Manager at Amazon
Principal Signal and Power Integrity Engineer at Samtec Inc.
Categories
Primary Track
- 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Secondary Track
- 10. Power Integrity in Power Distribution Networks, Power Supplies & Power Delivery
Education Level
- All
Discipline
- Artificial Intelligence
- Power Integrity
- Test & Measurement
Badge Access
- All-Access
- Premium Education
- Standard Education